Examine common VIA materials, shapes, and highlight core challenges in this joint event with Turner Laser Systems, PI, and ACS.
AUBURN, Mass., July 8, 2025 /PRNewswire-PRWeb/ -- Led by laser and motion experts, explore the latest advances in laser drilling of VIA holes — key to enabling higher bandwidth communication and compact device footprints. Attendees will gain insight into methods for overcoming core challenges through fixed-optic configurations, .
Matt Price (PI's Head of Agile Solutions Group), Mark Turner (CEO and Founder of Turner Laser Systems), and Jason Goerges (ACS Motion Control's VP Marketing) will share real-world examples, including glass wafer drilling, illustrate how these solutions deliver results. To conclude, we'll preview emerging innovations — such as XL SCAN, 3D error correction, and hybrid piezo motion — that hint at the future potential for even faster and more accurate manufacturing.
Industries Served
Semiconductor, photonics, optics, medical device manufacturing
Title: Latest Advances in Laser Drilling of VIA holes
Date: July 17, 2025
Time: 2:00 pm (ET)
PI Americas
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Media Contact
PI Press Releases, PI (Physik Instrumente) LP, (508) 832-3456, [email protected],
SOURCE PI (Physik Instrumente) LP
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