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High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.

AUSTIN, Texas, July 1, 2025 /PRNewswire-PRWeb/ -- High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.

"Lincstech has been supporting the electronics industry with high quality Printed Wiring Boards for over 60 years and are proud to be a mainstay in the industry. We are privileged to play a key role in industries from Semiconductor Test, ensuring the functionality of electronic devices, to life-saving medical devices and beyond in rapidly growing segments such as AI," said Eijiro Ikegami, President and CEO at Lincstech America Inc. "Lincstech is excited to join HDP User Group, especially as we are now a part of the Global Brands Manufacture (GBM) organization which is a member of the Passive Systems Alliance (PSA) group consisting of businesses producing Passive Components, Printed Circuit Boards, Electronic Manufacturing Services and IC Packaging. We look forward to working with HDP User Group and contributing to the advancement of PCBs and the greater electronics industry."

"I am pleased to welcome Lincstech to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in leading edge PCBs and 3D substrates for high-speed computing and data systems will contribute significantly to our emerging technology projects", said Larry Marcanti, Executive Director of HDP User Group.

About Lincstech

For more than 60 years, Lincstech has supported our customers' development work and contributed to higher product functionality with our Printed Wiring Boards, which are essential components in cutting edge electronics. Our technology is chosen for the newest life-enriching products because we work closely with our customers to understand their needs, cooperate in solving problems and overcome technological hurdles.

The most advanced digital technology is impossible without the Printed Wiring Boards that connect many parts to form a circuit. Through interconnecting technology, we aim to work with our customers to build a prosperous, sustainable society for the next generation.

Visit Lincstech at

About HDP

HDP User Group (), a global research and development organization based in Round Rock, Texas, is dedicated to reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly. This international industry-led group organizes and conducts R&D programs to address the industry's technical issues, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Singapore and Yokohama.

For more information, visit the HDP User Group on the internet at or contact Madan Jagernauth at [email protected], phone number +1 561.501.1567.

Media Contact

Madan Jagernauth, HDP User Group, 1 5615011567, [email protected],

SOURCE HDP User Group